Function(MOLD)
Function(MOLD)
This command can analyze a temperature distribution and a contact force distribution of a product during mold release and analyze a load on each ejector pin. The data can be used as a reference when examining the number and location of ejector pins.
This command supports examining causes for and verifying countermeasures against molding defects (deformation, whitening, etc.) that occur when releasing a product from a mold.
The command supports designers in examining the appropriateness of ejector pin locations and promotes cost reduction through early detection of molding defects.
The command analyzes sequentially cooling process, mold opening process, and ejection process, and displays results.
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